Modeling · Integration
3D interconnects & advanced packaging
From nano-TSV parameter optimization to automated thermo-mechanical modeling of 2.5D chip stacks.
The problem
Advanced packaging brings materials with different thermal and mechanical properties into close contact. Modeling their behavior through processing is essential for understanding stress and structural reliability.
My contribution
I developed Python-assisted equivalent-material modeling workflows and built thermo-mechanical simulations in COMSOL and ANSYS. The work connected automated model generation with practical chip-stack simulation.
Undergraduate thesis
Parameter Optimization of Nano-TSVs for 3D Integrated Circuits. This work formed an early connection between my integrated-circuit background and my current interest in vertically integrated devices.