Hong Kong · 2026I am a PhD student in Electronic Engineering at The Chinese University of Hong Kong, advised by Prof. Ni Zhao.
I explore BEOL-compatible devices, p-type oxides and monolithic 3D integration, with an interest in low-temperature fabrication. My background at Nanjing University spans integrated circuits, device simulation, industrial vision and intelligent hardware.
shurongcao0819@gmail.comI am exploring the materials, fabrication routes and device architectures that could bring new functionality above existing CMOS.
Low thermal budget · ALD / CVD · Interfaces
How can useful electronic devices be fabricated above completed CMOS? I am exploring low-temperature processing, materials selection, and the relationship between process history and device behavior.
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P-type channels · Defects · Complementary devices
My current interests include oxide semiconductors and emerging p-type materials, with particular attention to defects, contacts, threshold-voltage stability, and the opportunities for complementary electronics.
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Sequential integration · Gate stacks · Interlayer connections
I am interested in complementary device structures and sequential integration of active layers, bringing device physics together with practical fabrication constraints. ALD, CVD, and related thin-film processes form part of the fabrication routes I am exploring.
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IEEE International Test Conference in Asia (ITC-Asia), pp. 43–47, 2025.
A lightweight, feature-aware detector for semiconductor wafer inspection. Evaluated on 5,723 labeled defect images: 90.7% AP@0.5, 7.19% false-negative rate, and 13.3M parameters.
The architecture combines a Multi-Scale Depthwise Block for efficient texture encoding with a Token-Energy Diagonal Attention head for feature refinement. The work addresses subtle, low-contrast wafer defects while keeping the model compact for manufacturing inspection. My research work included data preparation, model benchmarking, architecture improvement, and scientific writing.
@inproceedings{zhang2025falcowafer,
title={FALCO-WAFER: Feature-Aware Lightweight Contextual Detector for Wafer Defect Detection},
author={Zhang, Haotian and Cao, Shurong and Zou, Ningmu},
booktitle={2025 IEEE International Test Conference in Asia (ITC-Asia)},
pages={43--47},
year={2025},
doi={10.1109/ITC-Asia67627.2025.00016}
}Download .bib
arXiv:2409.06367, 2024 · CVM 2026 conference program.
An industrial anomaly-detection benchmark covering 15 cloth types, 14 semiconductor wafer types, and 10 metal-plate types, with pixel-level defect annotations.
Texture-AD examines the gap between algorithm development and production-line inspection through representative textures acquired under different optical schemes. The benchmark supports evaluation of how methods generalize across products.
@misc{lei2024texturead,
title={Texture-AD: An Anomaly Detection Dataset and Benchmark for Real Algorithm Development},
author={Lei, Tianwu and Wang, Bohan and Chen, Silin and Cao, Shurong and Zou, Ningmu},
year={2024},
eprint={2409.06367},
archivePrefix={arXiv}
}Download .bib
Modeling · Integration
From nano-TSV parameter optimization to automated thermo-mechanical modeling of 2.5D chip stacks.
Device physics · Simulation
A semiconductor sensing concept explored through device architecture, multiphysics modeling, and simulation verification.
Hardware · Perception · Control
An integrated PYNQ-Z2, Raspberry Pi 5, and STM32 system combining perception, mapping, and motion control.
Maintainer · Research software
Local-first provenance, calibration records, uncertainty budgets, and evidence bundles for engineering experiments.
Research software I maintain, and improvements to the open-source tools we rely on.
GitHub · @CAOShurongExplore my GitHubRepositories, contributions & ongoing work ↗Improved XML schema loading for encoded filesystem paths in the CycloneDX Python library.
Listed by account name and university in the project’s contributor directory.
Enabled URL-based feature flags for headerless hosted connections, while preserving OAuth query handling.
Named in the release’s New Contributors section.
Contributed a reproducible BenchLineage exchange archive demonstrating the mapping from research provenance to the ELN file format.
The official repository hosts the example and links to BenchLineage, its documentation and package.
Fixed numeric color ordering in parallel-categories bundles and clarified axis spike behavior across hover modes.
Two changelog entries credit these contributions by account name.