
Modeling · Integration
3D interconnects & advanced packaging ↗
From nano-TSV parameter optimization to automated thermo-mechanical modeling of 2.5D chip stacks.
Projects
Selected work across devices, simulation, intelligent hardware, and software for research.
Official project acknowledgements ↗

Modeling · Integration
From nano-TSV parameter optimization to automated thermo-mechanical modeling of 2.5D chip stacks.

Device physics · Simulation
A semiconductor sensing concept explored through device architecture, multiphysics modeling, and simulation verification.

Hardware · Perception · Control
An integrated PYNQ-Z2, Raspberry Pi 5, and STM32 system combining perception, mapping, and motion control.
Maintainer · Research software
Local-first provenance, calibration records, uncertainty budgets, and evidence bundles for engineering experiments.
A terminal serial plotter for live data from Arduino, ESP32, and STM32 over UART, pipes, or SSH.
An embedded project combining line tracking, ultrasonic ranging, obstacle avoidance, Bluetooth control, and OLED output.